Mission-Critical Components.
End-to-End Execution.

Bridging Japan's elite manufacturing capabilities with the demanding requirements of the North American Aerospace, Robotics, Automotive, and Medical supply chains. From analog circuit design to advanced substrate packaging, we manage the entire build-to-print lifecycle.

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■ Aerospace & Defense
■ EV & Autonomous Automotive
■ Advanced Robotics & AI
■ Precision Medical Devices

Core Technologies & Design Guidelines

High-Frequency PCB Board

High-Frequency PTFE Boards

Engineered for low dielectric loss, essential for satellite communication, autonomous vehicle LiDAR arrays, and 5G/6G infrastructure.

  • Materials: Rogers, Taconic, Chukoh Chemical
  • Dielectric Constant (Dk): Under 2.0 capable
  • Design: Hybrid (Rigid-Flex) combinations available
Close-up motherboard with CPU chip for high-power thermal electronics

High Power & Thermal PCBs

Built for EV wireless charging, AI edge-computing data centers, and power semiconductors requiring extreme heat dissipation.

  • Copper Thickness: 70µm to 300µm (Thick Cu)
  • Structure: Busbar embedded & Copper Inlay capable
  • Materials: Metal base (Al/Cu) & High thermal resin
Advanced Ceramic Macro

Advanced Ceramic & Quartz

The standard for vacuum-environment heat sinks, hermetic packaging, and high-frequency signaling. Ideal for surgical robotics and optical switching.

  • Substrates: Aluminum Nitride (AlN), Alumina, Quartz Glass
  • Benefits: Superior thermal management & ultra-low signal loss
  • Sealing: Precision Kovar Brazing capabilities
Printed circuit board with gold pathways for MSAP and fine-pitch flex technology

MSAP & Fine Pitch Flex PCBs

Modified Semi-Additive Process (MSAP) for space-constrained semiconductor packaging, vital for medical implants and AI chips.

  • Minimum Pitch (Flex): Down to 30µm
  • Min Hole Dia: Through-hole Ø0.1mm, Pad Ø0.25mm
  • Layers: Single, Double, and Multi-layer Rigid-Flex
Advanced component assembly and procurement

Advanced Component Assembly & Procurement

Beyond board fabrication, we act as a complete vendor management solution. We source difficult-to-find components and perform aerospace-grade assembly in-house, preventing oxidation and solder defects common in high-heat thermal PCBs.

  • Wire Bonding (Gold, Aluminum, Copper) & Die Bonding
  • N2 (Nitrogen) & Formic Acid Reflow Soldering
  • BGA, CSP, 0402/0201 chip, and Au-Sn Mounting
  • Inspection: 3D X-ray, AOI, and SAT (Scanning Acoustic Tomography)

Industry Standards & Compliance

Built to Meet Exacting Global Standards

Our manufacturing network in Japan is equipped to handle the rigorous quality management systems required by top-tier North American OEMs. We ensure full traceability and zero-defect tolerances across mission-critical sectors.

AS9100 / EN9100
Aerospace & Defense
IATF 16949
Automotive & EV
ISO 13485
Medical Devices
ISO 9001 & 14001
Quality & Environmental

ITAR & Export Control Integration

We manage the complex logistics of US export controls, determining component regulatory status under EAR99 and assessing ECCN parameters. We provide standard US procurement systems with trusted, fully compliant build-to-print fulfillment without the headache of foreign vendor setup.